Q²M Compound+ is a heavy cutting paste that delivers an improved level of scratch removal and high abrasion with a low level of dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish.

HIGH CUTTING POWER AND GLOSSY FINISH

Q²M Compound+ delivers increased cutting power without the usual price of enormous defects. The formula is water-based and contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make the procedure of pre-coating preparation and polish removal much faster and easier.

BEST PRACTICE AND PRO-TIPS

Q²M Compoud+ is unlike any other cutting polish. Work in small sections, moving your polisher slowly across the surface. TIP: Q²M Compound+ has its highest cutting abilities during the first period of the work cycle. Each attempt should take no longer than 45 seconds.

Capacity: 1000ML

Made in South Korea